JPH0376006B2 - - Google Patents
Info
- Publication number
- JPH0376006B2 JPH0376006B2 JP62038882A JP3888287A JPH0376006B2 JP H0376006 B2 JPH0376006 B2 JP H0376006B2 JP 62038882 A JP62038882 A JP 62038882A JP 3888287 A JP3888287 A JP 3888287A JP H0376006 B2 JPH0376006 B2 JP H0376006B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding material
- lead terminal
- lead
- lead terminals
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62038882A JPS62234311A (ja) | 1987-02-21 | 1987-02-21 | リ−ド端子素材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62038882A JPS62234311A (ja) | 1987-02-21 | 1987-02-21 | リ−ド端子素材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62234311A JPS62234311A (ja) | 1987-10-14 |
| JPH0376006B2 true JPH0376006B2 (en]) | 1991-12-04 |
Family
ID=12537580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62038882A Granted JPS62234311A (ja) | 1987-02-21 | 1987-02-21 | リ−ド端子素材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234311A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05275155A (ja) * | 1992-03-24 | 1993-10-22 | Taiyo Yuden Co Ltd | 回路基板に外部接続端子を接続する方法 |
| JPWO2011162181A1 (ja) * | 2010-06-21 | 2013-08-22 | コーア株式会社 | 面実装バリスタ |
| JP6040910B2 (ja) * | 2013-10-24 | 2016-12-07 | 株式会社デンソー | 半導体素子、および、半導体素子の有する端子への半田の付着方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6210984Y2 (en]) * | 1979-12-13 | 1987-03-16 | ||
| JPS6214667Y2 (en]) * | 1980-02-26 | 1987-04-15 |
-
1987
- 1987-02-21 JP JP62038882A patent/JPS62234311A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62234311A (ja) | 1987-10-14 |
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